Bi-Phasic Ag–In–Ga-Embedded Elastomer Inks for Digitally Printed, Ultra-Stretchable, Multi-layer Electronics
نویسندگان
چکیده
A bi-phasic ternary Ag-In-Ga ink that demonstrates high electrical conductivity, extreme stretchability, and low electromechanical gauge factor (GF) is introduced. Unlike popular liquid metal alloys such as eutectic gallium-indium (EGaIn), this easily printable nonsmearing bonds strongly to a variety of substrates. Using simple extrusion printer, the ability perform direct writing ultrathin, multi-layer circuits are highly stretchable (max. strain >600%), have excellent conductivity (7.02 × 105 S m-1), exhibit only modest GF (0.9) related ratio percent increase in trace resistance with mechanical demonstrated. The synthesized by mixing optimized quantities EGaIn, Ag microflakes, styrene-isoprene block copolymers, which functions hyperelastic binder. When compared same composite without shows over 1 order magnitude larger up ∼27× lower GF, ∼5× greater maximum stretchability. No significant change was observed after 1000 cycles. Microscopic analysis EGaIn microflakes promotes formation AgIn2 microparticles, resulting cohesive ink. can be sintered at room temperature, making it compatible many heat-sensitive Additionally, utilizing commercial based stencil-free, digital printing various substrates, including medical wound-dressing adhesives, demonstrated for first time.
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ژورنال
عنوان ژورنال: ACS Applied Materials & Interfaces
سال: 2021
ISSN: ['1944-8244', '1944-8252']
DOI: https://doi.org/10.1021/acsami.0c22206